RELIANCE 0-57C407远程头输入/输出
3排最大70W低于70W1 5排最大90W低于90W1热要求MVME7100模块在55°C（131°F）环境温度下运行时，要求最小气流为10 CFM，均匀分布在整个电路板上，气流从散热器流到PMC2现场。2.3.4显热部件下表总结了显着温升的部件。这些部件应进行监测，以评估热性能。该表还提供了部件参考代号和最大允许工作温度。您可以通过参考代号在板上找到组件，如下一页的图2-1和图2-2所示。未完全填充的电路板版本可能不包含这些组件。组件的首选测量位置可能是表中指定的连接点、外壳或环境。结温是指由芯片上的热装置测量的温度。外壳温度是指部件顶部中心表面的温度。空气温度是指部件附近的环境温度。
3-Row 70W maximum Below 70W1 5-Row 90W maximum Below 90W1 Thermal Requirements The MVME7100 module requires a minimum air flow of 10 CFM uniformly distributed across the board, with the airflow traveling from the heat sink to the PMC2 site, when operating at a 55°C (131°F) ambient temperature. 2.3.4 Thermally Significant Components The following table summarizes components that exhibit significant temperature rises. These are the components that should be monitored to assess thermal performance. The table also supplies the component reference designator and the maximum allowable operating temperature. You can find components on the board by their reference designators as shown in Figure2- 1 and Figure2-2 on the next page. Versions of the board that are not fully populated may not contain some of these components.The preferred measurement location for a component may be junction, case, or ambient as specified in the table. Junction temperature refers to the temperature measured by an onchip thermal device. Case temperature refers to the temperature at the top, center surface of the component. Air temperature refers to the ambient temperature near the component.
