HIMA H4116处理器卡件,输出卡件
（第10.1节和10.1.5节）。关于同时进行PNC001、PNS001和GCG001硬件更新的说明。2017年9月N日为ALG106和ALG112模块添加脚注44。更新了ALG106/112/306/412/508/600/704/708/728/808和CMM002/004的规格表。更新客户服务联系信息。T Sep-19·增加ETM001 Kxxx（ETM模块重新设计和兼容性更改）·关于FW 9.90 PACSystems*RX3i系统手册第2节GFK-2314T 2019年9月简介2修订日期描述M 2016年7月更新远程Hart获取设备信息COMMREQ的第11章。此外，还有更新以澄清双字COMMREQ状态字的高位字（命令状态）。L Feb-16为模拟输出模块8通道电流/电压隔离：IC695ALG808添加了新部分，用于配置：IC695ALG808和模块数据：IC695ALG808。2015年12月K日更新了RX3i CEP载体支持的I/O模块列表2015年11月J日新硬件替换了生产中的现有硬件版本，之前版本的FAB板（C0版）已全部用完。这适用于Rx3i和90-30系统。更新了输出点和电压范围H Sep-15更新了模块负载要求G Jun-15添加了新模块IC695EDS001和IC695EIS001。增加HART直通功能。更新了IC695CEP001（固件版本为2.40）和IC694CEE001支持的模块列表。修改了MDL250、MDL260、MDL350和MDL660的模块状态中模块I/O数据就绪位的检测。此位的含义在先前的文档中被颠倒，并在本次更新中被更正。F 2014年12月更新IC695CEP001和IC694CEE001 PACSystems*RX3i系统手册第2节GFK-2314T 2019年9月简介3修订日期描述E 2014年7月添加了新模块IC694MDL648、IC694MDL 730、IC694LDL758、IC691MDR390、IC694ALG542、IC695RMX228、IC695PMM335、IC695ECM850、IC695PNS001、IC695GCG001、IC69CEP001和ICM4CEE001。修订了第2节：热插拔表。更新了第8节中IC694APU300的内容（添加了增强模式）：。将IC694APU305移至第8节：。更新了ALG106和ALG112的功耗规格。修正了ALG222和ALG232的现场接线图，更新了第17节：。对于IC693ACC3xx接线板，添加了端子和D连接器之间的新图表和连接信息。添加了此快速连接系统工作原理的概述。还将前附录B（32点模块接线板和电缆）纳入第17节：。PACSystems*RX3i系统手册第2节GFK-2314T 2019年9月简介4 1.2概述1.2.1具有高速处理器和专利技术，可提高吞吐量▪ 通用背板，每个模块插槽支持两条不同的背板总线：o高速、基于PCI的新型高级I/o的快速吞吐量o RX3i串行模块的串行背板和90-30系列I/o的轻松迁移▪ 选择CPU以满足广泛的编程和性能需求。请参阅PACSystems RX3i和RSTi EP CPU参考手册GFK-2222。RX3i CPU产品线包括：CPL410 1.2 GHz AMD G系列四核、64 MB用户内存和Linux CPE400 1.2 GHz AMD G-Series四核、，64 MB用户内存，带有Field Agent CPE330 1 GHz双核CPU（64 MB用户存储器）和嵌入式Ethernet/PROFINET CPE302 1.1 GHz CPU（2 MB用户内存）以及嵌入式以太网CPE305 1.1 GHz CPU，5 MB用户内存以及嵌入式以太网CPU310 1.1 GHz CPU和嵌入式以太网CPU115 1 GHz CPU（1.5 MB用户内存和嵌入式以太网/PROFINET）CPE100 1 GHz CPU，带1 MB用户内存和嵌入式以太网/PROFINET CPU310 300 MHz CPU，带10 MB用户内存CPU315 1 GHz CPU和20 MB用户内存CPU CPU320 1 GHz CPU以及64 MB用户内存CRU320 1 GHz冗余CPU，带64 MB用户存储器NIU001 300 MHz以太网网络接口单元NIU001+1.1 GHz以太网网络接口▪ 在控制器中存储梯形图逻辑文档和机器文档，以减少停机时间并改进故障排除▪ 开放式通信支持PACSystems*RX3i系统手册第2节GFK-2314T 2019年9月简介5▪ 各种离散、模拟和专用模块▪ 热插入两个
(Sections 10.1 & 10.1.5). Notes concerning concurrent PNC001, PNS001 and GCG001 hardware updates. N Sep-17 Added footnote #44 for ALG106 & ALG112 modules. Updated Spec Sheets for ALG106/112/306/412/508/600/704/708/728/808 & CMM002/004. Update customer care contact info. T Sep-19 · Addition of ETM001-Kxxx (ETM module redesign and compatibility change) · Updates with Respect to FW 9.90 PACSystems* RX3i System Manual Section 2 GFK-2314T Sept. 2019 Introduction 2 Rev Date Description M Jul-16 Updated Chapter 11 for the Remote Hart Get Device Information COMMREQ. Additionally, there were updates to clarify the upper word (command status) of the twoword COMMREQ status word. L Feb-16 Added new sections to Analog Output Module 8-Channel Current/Voltage Isolated: IC695ALG808 for Configuration: IC695ALG808 and Module Data: IC695ALG808. K Dec-15 Updated RX3i CEP Carrier list of Supported I/O Modules J Nov-15 New hardware replaces the existing hardware revision in production after full consumption of previous revision FAB boards (C0 rev). This is applicable for both Rx3i and 90-30 systems. Updated Output points and voltage range H Sep-15 Updated module load requirements G Jun-15 Added new modules IC695EDS001 and IC695EIS001. Added HART Pass Though functionality. Updated list of modules supported by IC695CEP001 (up to firmware rev 2.40) & IC694CEE001. Revised sense of Module I/O Data Ready bit in Module Status for MDL250, MDL260, MDL350 & MDL660. The sense of this bit was inverted in prior documentation and is corrected in this update. F Dec-14 Updates for IC695CEP001 & IC694CEE001 PACSystems* RX3i System Manual Section 2 GFK-2314T Sept. 2019 Introduction 3 Rev Date Description E Jul-14 Added new modules IC694MDL648, IC694MDL730, IC694MDL758, IC694MDR390, IC694ALG542, IC695RMX228, IC695PMM335, IC695ECM850, IC695PNS001, IC695GCG001, IC695CEP001 & IC694CEE001. Revised Hot Insertion and Removal table in Section 2:. Updated content for IC694APU300 (added Enhanced mode) in Section 8:. Moved IC694APU305 to Section 8:. Updated power consumption specifications for ALG106 and ALG112. Corrected Field Wiring diagrams for ALG222 & ALG232 Updated Section 17:. For IC693ACC3xx terminal blocks, added new diagrams and connection info between terminals and D-connectors. Added overview of how this quick-connect system works. Also absorbed former Appendix B (32-point module terminal blocks and cables) into Section 17:. PACSystems* RX3i System Manual Section 2 GFK-2314T Sept. 2019 Introduction 4 1.2 Overview 1.2.1 Features High-speed processor and patented technology for faster throughput ▪ Universal backplane that supports two different backplane busses per module slot: o High-speed, PCI-based for fast throughput of new advanced I/O o Serial backplane for RX3i serial modules and easy migration of Series 90-30 I/O ▪ Selection of CPUs to meet a wide range of programming and performance needs. Refer to the PACSystems RX3i and RSTi-EP CPU Reference Manual, GFK-2222. The RX3i product line of CPUs includes: CPL410 1.2 GHz AMD G-Series Quad Core, 64 MB user memory with Linux CPE400 1.2 GHz AMD G-Series Quad Core, 64 MB user memory with Field Agent CPE330 1 GHz dual core CPU with 64 MB of user memory and embedded Ethernet/PROFINET CPE302 1.1 GHz CPU with 2 MB of user memory and embedded Ethernet CPE305 1.1 GHz CPU with 5 MB of user memory and embedded Ethernet CPE310 1.1 GHz CPU with 10 MB of user memory and embedded Ethernet CPE115 1 GHz CPU with 1.5 MB of user memory and embedded Ethernet/PROFINET CPE100 1 GHz CPU with 1 MB of user memory and embedded Ethernet/PROFINET CPU310 300 MHz CPU with 10 MB of user memory CPU315 1 GHz CPU with 20 MB of user memory CPU320 1 GHz CPU with 64 MB of user memory CRU320 1 GHz Redundancy CPU with 64 MB of user memory NIU001 300 MHz Ethernet Network Interface Unit NIU001+ 1.1 GHz Ethernet Network Interface Unit ▪ Memory for ladder logic documentation and machine documentation in the controller to reduce downtime and improve troubleshooting ▪ Open communications support PACSystems* RX3i System Manual Section 2 GFK-2314T Sept. 2019 Introduction 5 ▪ Variety of discrete, analog, and special-purpose modules ▪ Hot insertion in both
