VMIVME-5504工控模块备件
典型特性除非另有说明源漏二极管正向电压阈值导通电阻与栅源电压单脉冲电源安全工作区接头至环境温度 源极至漏极电压 源极电流 µ 温度 导通电阻栅极至源极电压 功率时间 单脉冲 受限于开启*受限于 µ 漏极到源极电压*>指定打开时的最小 漏极电流 。 版本。 年月日文件编号：有关技术问题请联系：@本文件如有更改恕不另行通知。此处所述的产品和本文件受上规定的具体免责声明的约束。典型特性除非另有说明否则为电流降额和功率降额注。功率耗散基于最大值使用结到壳的热阻在使用额外散热的情况下更适用于确定耗散上限。当该额定值低于封装限制 外壳温度 漏电流封装限制 –外壳温度功率 时用于确定电流额定值。
此处所述的产品
本文件受上规定的具体免责声明的约束。典型特性除非另有说明标准化热瞬态阻抗接头到环境标准化热瞬变阻抗接头至脚 保持全球制造能力。产品可在几个合格地点之一生产。硅技术和封装可靠性的可靠性数据代表所有合格位置的组合。有关包装胶带图纸零件标记和可靠性数据等相关文件请访问 方波脉冲持续时间归一化有效瞬态热阻抗 注释：占空比每单位基础 。表面安装占空比单脉冲 占空比方波脉冲持续时间归一化有效瞬态热阻抗 单脉冲 包装信息文件编号 座椅平面 量规平面座面
Typical characteristics Unless otherwise specified, source drain diode forward voltage threshold on resistance and grid source voltage Single pulse power supply Safe working area connector to ambient temperature Source to drain voltage Source current µ Temperature on resistance Grid to source voltage Power time Single pulse is limited to ON * Limited to µ Drain to source voltage *>Minimum drain current when specified to ON. edition. Document No.: For technical problems, please contact: @ This document is subject to change without notice. The products described herein and this document are subject to the specific disclaimers set forth above. Typical characteristics are current derating and power derating unless otherwise stated. Power dissipation is based on the maximum value. The use of junction to shell thermal resistance is more suitable for determining the upper dissipation limit when additional heat dissipation is used. This rating is used to determine the current rating when it is lower than the enclosure temperature leakage current enclosure limit enclosure temperature power.
Products described here
This document is subject to the specific disclaimers set forth above. Typical characteristics Standardized thermal transient impedance connector to environment Standardized thermal transient impedance connector to pin maintains global manufacturing capability unless otherwise specified. The product can be produced in one of several qualified locations. Reliability data for silicon technology and package reliability represent a combination of all qualified locations. For relevant documents such as packaging tape drawings, part marks and reliability data, please visit the normalized effective transient thermal impedance of square wave pulse duration note: duty cycle per unit basis. Surface mounting duty cycle Single pulse duty cycle Square wave pulse duration normalization Effective transient thermal impedance Single pulse packaging information File number Seat plane Gauges Plane seating surface
