KLA Tencor 710-658172-20晶圆检查器底板 PDF资料
1.产 品 资 料 介 绍：
中文资料：
KLA Tencor 710-658172-20 晶圆检查器底板
产品概述：
该底板是一种专用于KLA Tencor晶圆检测设备的核心电路连接组件，通常安装在设备的主控制系统中，用于协调和管理多个功能模块的电信号及电源分配。
主要功能
信号集中管理：
起到中央总线的作用，汇集图像处理、电机控制、传感器反馈等各类信号，进行统一分配和处理。电源分布与保护：
分配来自主电源的多路电压到各个子模块，并具备基本的过流、过压保护功能，确保系统运行安全。模块间通信桥梁：
实现如图像采集卡、运动控制卡、数据存储单元等之间的互连，为高效的数据流和控制指令传递提供硬件平台。提升系统可靠性与维护性：
模块化设计，允许热插拔与快速维护，支持现场替换和扩展，减少系统停机时间。
技术特点
高稳定性 PCB 多层设计，优化信号完整性与电源隔离。
工业级连接器，确保长期可靠接触与抗震动能力。
支持多通道高速通信，适配KLA Tencor主流检测平台（如21xx系列）。
环境适应性强，适合洁净室环境下的连续工作。
典型应用场景
晶圆缺陷检测设备：作为系统总线，协调图像采集与数据分析单元工作。
自动光学检测设备（AOI）：管理高速图像处理模块与驱动控制单元之间的通信。
半导体晶圆厂产线设备：用于关键设备中的子系统集成，提升整体控制性能和可靠性。
英文资料：
KLA Tencor 710-658172-20 Wafer Inspection Board
Product Overview:
This motherboard is a core circuit connection component specifically designed for KLA Tencor wafer inspection equipment, typically installed in the main control system of the equipment to coordinate and manage electrical signals and power distribution for multiple functional modules.
major function
Centralized signal management:
Plays the role of a central bus, collecting various signals such as image processing, motor control, sensor feedback, etc., for unified distribution and processing.
Power distribution and protection:
Allocate multiple voltages from the main power supply to each submodule, and have basic overcurrent and overvoltage protection functions to ensure the safe operation of the system.
Communication bridge between modules:
Realize the interconnection between image acquisition cards, motion control cards, data storage units, etc., providing a hardware platform for efficient data flow and control instruction transmission.
Improve system reliability and maintainability:
Modular design allows for hot swapping and quick maintenance, supports on-site replacement and expansion, and reduces system downtime.
FEATURES
High stability PCB multi-layer design optimizes signal integrity and power isolation.
Industrial grade connectors ensure long-term reliable contact and vibration resistance.
Supports multi-channel high-speed communication and is compatible with mainstream KLA Tencor detection platforms (such as the 21xx series).
Strong environmental adaptability, suitable for continuous work in clean room environments.
Typical application scenarios
Wafer defect detection equipment: As a system bus, it coordinates the work of image acquisition and data analysis units.
Automatic Optical Inspection Equipment (AOI): Manage communication between high-speed image processing modules and drive control units.
Semiconductor wafer fab production line equipment: used for subsystem integration in critical equipment to enhance overall control performance and reliability.
2.产 品 展 示
3.其他产品
4.其他英文产品
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| PMB31D-10114-03 | NKMP11 | M22NRXB-LNN-NS-02 |
| PMB31D-10114-02 | AMAT 0100-13011 | 57160001-LF DSTD 133 |
| PMB31D-10114-01 | 70 FA 01b | PWM3636-5486-7 |
| PMB31D-10114-00 | IIMCL01 | 57160001-FH DSTD 170 |
| PMB31D-10101-03 | 70 BL 02C | N42HRFM-LNK-NS-00 |
| PMB31D-10101-02 | AMAT 0100-09136 | 57120001-HP DSTA 145 |
| PMB31D-10101-01 | 07YS81 | P21NSXC-LNN-NS-04 |
| PMB31D-10101-00 | Amat 0100-02839 | 57170001-A DSXS 001 |
| PMB31D-10100-03 | PHAREPRFO10000 | M22NRFB-LDN-NS-00 |
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