Brooks 002-7391-11晶圆对齐器 PDF资料
1.产 品 资 料 介 绍:
中文资料:
Brooks 002-7391-11 晶圆对齐器 是 Brooks Automation 提供的一种关键设备,专为半导体制造过程中晶圆的精确对齐而设计。晶圆对齐器在半导体的加工、刻蚀、光刻和其他精密处理过程中扮演着至关重要的角色,能够确保晶圆在各个处理阶段中的准确定位。
主要特点和功能:
高精度对齐:
- Brooks 002-7391-11 晶圆对齐器 提供极高的定位精度,能够精确对准晶圆上的各个图形或标记。这对于光刻、刻蚀、薄膜沉积等精密工艺至关重要,能够保证每次加工都达到所需的高精度要求。
自动化操作:
- 晶圆对齐器通常配备自动化操作系统,可以自动调整晶圆的位置和角度,减少人工干预,提高生产效率和准确性。自动化功能还可以减少错误和提高整体生产过程的一致性。
适应性强:
- 该设备可以适应多种晶圆尺寸和类型,通常适用于 200mm(8英寸) 和 300mm(12英寸) 晶圆的对准,也可以根据需求支持其他尺寸的晶圆。晶圆对齐器的设计灵活,能够兼容多种晶圆载具和处理设备。
实时检测和反馈:
- 晶圆对齐器内置高精度传感器和摄像系统,能够实时监控晶圆的对齐状态,检测任何偏差并提供反馈。系统可以自动进行微调,确保晶圆精确对位,并避免生产过程中的偏差。
支持多工位操作:
- 在某些应用中,晶圆对齐器支持多工位操作,能够同时对多个晶圆进行精确对齐,提高生产效率。多工位支持可以显著提升大规模生产线的自动化水平。
高稳定性和耐用性:
- Brooks 002-7391-11 晶圆对齐器 设计上注重稳定性和耐用性,特别是在洁净室环境和长时间运行条件下,它能够维持高效能,减少故障和维护成本。高质量的机械组件和材料确保其在高强度应用中的稳定性。
精确的运动控制:
- 对齐器通常配备精密的运动控制系统,能够确保晶圆在操作过程中精确移动并对齐。精确的运动控制系统能最大程度地减少晶圆位置的偏差。
英文资料:
The Brooks 002-7391-11 wafer aligner is a critical equipment provided by Brooks Automation, designed specifically for precise alignment of wafers in semiconductor manufacturing processes. Wafer aligners play a crucial role in semiconductor processing, etching, photolithography, and other precision manufacturing processes, ensuring accurate positioning of wafers at various stages of processing.
Main features and functions:
High precision alignment:
The Brooks 002-7391-11 wafer aligner provides extremely high positioning accuracy and can accurately align various shapes or marks on the wafer circle. This is crucial for precision processes such as photolithography, etching, and thin film deposition, ensuring that each processing meets the required high precision requirements.
Automated operation:
Wafer aligners are typically equipped with automated operating systems that can automatically adjust the position and angle of wafers, reducing manual intervention and improving production efficiency and accuracy. Automation functions can also reduce errors and improve overall production process consistency.
Strong adaptability:
This device can accommodate multiple wafer sizes and types, typically suitable for alignment of 200mm (8 inches) and 300mm (12 inches) wafers, and can also support wafers of other sizes as needed. The design of wafer aligners is flexible and compatible with various wafer carriers and processing equipment.
Real time detection and feedback:
The wafer alignment device is equipped with high-precision sensors and camera systems, which can monitor the alignment status of the wafer in real time, detect any deviations, and provide feedback. The system can automatically perform fine adjustments to ensure precise wafer alignment and avoid deviations during the production process.
Support multi station operation:
In some applications, wafer aligners support multi station operations and can accurately align multiple wafers simultaneously, improving production efficiency. Multi station support can significantly improve the automation level of large-scale production lines.
High stability and durability:
The design of Brooks 002-7391-11 wafer aligner emphasizes stability and durability, especially in clean room environments and long-term operating conditions, it can maintain high efficiency, reduce failures and maintenance costs. High quality mechanical components and materials ensure their stability in high-strength applications.
Accurate motion control:
Aligners are typically equipped with precision motion control systems that ensure precise movement and alignment of wafers during operation. A precise motion control system can minimize the deviation of wafer position to the greatest extent possible.
2.产 品 展 示
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